Mechanism for the local planarization of microscopically rough surfaces by. Apr 04, 1998 fabrication of nanostructured polymer surfaces using colloidal lithography and spincoating. In addition to the advantages of this technique, this chapter also discusses common technical problems together with possible solutions. Solvent concentration measurement for spin coating gu. This generally permits study of the planarization of real device structures, including both isolated and neighboring features, with any orientation with respect to the wafer center. Planarization of deep structures using selfleveling materials. Bcb bisbenzocyclobutane that is spun on the wafer with prefabricated device structures 6. We show that spin coating produces conformal film profiles over gaps on the substrate with widths greater than about 50 pm and. Dielectric coating dc4500 1 technical information description dielectric coating dc4500 is a polysiloxanebased spin on dielectric material, which is used in planarization of surface topography. An empirical model is proposed for predicting surface variations following dielectric spin coating as applied to existing underlying topography in redistribution layer fabrication. Spin bake cure procedure for spinonglass materials.
Oct, 2017 surface roughness was evaluated with an atomic force microscope brucker dimension icon, germany before and after spin coating and after ion beam planarization. Numerical study spin coating has been mainly used to produce photoresistcoated layers on wafers in the semiconductor fabrication process due to. The spin on polymer layer is usually thicker than the devices in order to seal the device completely. Uniform planarization technique for the realization of a. Then planarization is achieved by etchback of polymer to the device top to expose the top surface for metal interconnection 7. Jul 01, 2014 the proposed coating process for topography planarization is illustrated in fig. Us10329452b2 materials and spin coating methods suitable. Modeling spin coating over topography and uniformity. This was confirmed by dispensing the hsq slowly before spincoating. The accuflo layer and the spin onglass layer are etched back by two etching steps with different etching rate. This paper reports the results of a study of topographic substrate planarization with films applied by a spin coating process.
Spin bake cure procedure for spin onglass materials for interlevel and intermetal dielectric planarization effective utilization of honeywell spin on glass materials for the planarization of integrated circuits requires that the proper spin bakecure procedures be applied in order to achieve a high quality. Control ability of spin coating planarization of resist. A composition is provided including a resin including one or more siliconbased materials, one or more organicbased materials, or a combination of siliconbased materials and organicbased materials. High density silicon dioxide coatings by uv and thermal. This technique is often used for planarization purposes. A large diameter 65 mm disk with nanotopographical features was fabricated using a ballup technique and rie. Controlling aggregate formation in conjugated polymers by. Analytical solutions of film planarization during lateral.
Us patent for materials and spin coating methods suitable. Jun 14, 2012 spin coating processes are used in the microelectronics industry to coat wafers with photoresist which allow already existing layers on the wafer to be selectively etched. Planarization of substrate topography by spin coating. A planarizing coating produces a global flat surface and. Model for spin coating in microelectronic applications. In the first, or flow, stage of the model, the film profile over a feature is assumed to be controlled by a balance of centrifugal and capillary. Usually a small amount of coating material is applied on the center of the substrate, which is either spinning at low speed or not spinning at all. Uniform planarization technique for the realization of a twin. Pdf this study focuses on ultraviolet crosslink process using spin coating materials for advanced planarization and sublimate defect reduction in the. The twodimensional model can predict film thickness on nonuniform flat substrate. Jan 01, 2006 table 2 shows the planarization results of bcb at different spin speed. The composition further includes a first solvent having a boiling point from 140 c.
Ultraviolet crosslink process using spincoating materials. This study focuses on ultraviolet crosslink process using spin coating materials for advanced planarization and sublimate defect reduction in the advanced process techniques of semiconductor, display, and new electronic devises. Spin coating and planarization spie digital library. Jan 29, 2011 planarization of bpm was performed using spin coating of hsq. We show that spin coating produces conformal film profiles over gaps on the substrate with widths greater than. Planarization of patterned magnetic recording media to enable. At high spin coating speeds, the bulk of the hsq is spun off the disk before it fills the patterned regions, while at low spin coating speeds, the hsq is able to better flow into the patterned regions.
Pdf model for spin coating in microelectronic applications. A thorough investigation of the mass and momentum equations pertaining to the spin. May 31, 2017 materials and spin coating methods suitable for advanced planarization applications may 31, 2017 honeywell international inc. Us patent for materials and spin coating methods suitable for. This has to be reduced to 400 nm or a little less, to expose the semiconductor surface for further processing. Leveling of thin films over uneven substrates during spin. Spin coating planarization of integrated circuit topography. Dielectric spin coating characterization, modeling, and planarization. Spin coating and planarization spin coating and planarization stillwagon, larry e larson, ronald g taylor, gary n. Planarization of spincoated polymer films is of great importance for the lithographic. Fluids a 2, 1937 1990 is extended to account qualitatively for solvent evaporation.
Modulable nanometerscale surface architecture using spincoating on an adsorbed collagen layer. Spin coating planarization of integrated circuit topography on a rotating disk volume 227 roger k. All the materials are spin on materials and can be applied with existing spin coating and lithography tool sets. Planarization of high topography surfaces with deep holes. Spincoating of dilute magnetic colloids in a magnetic field.
Methods for applying coatings to substrates are also provided. It is primarily intended for substrates up to the maximum size. Spin coating is also used to apply thin layers of polymers to wafers for various steps through out the manufacture of processed wafers. Spin coating is a batch process in which a liquid film is spread by centrifugal force onto a rotating substrate. Novel planarization and passivation in the integration of.
Planarization of patterned magnetic recording media to. Spin coating is a batch process in which a liquid film is spread by centrifugal force. Spin coating on spherical surface with large central angles mdpi. Spincoating of colloids is a versatile method in fabricating films of colloidal. Spin coating is a good method for spreading uniform thin films of polymers that are extremely sticky or. A recently proposed twostage flowshrinkage model of leveling or planarization of uneven substrate topography during spin coating stillwagon and larson, phys. Special spin coating and resist characteristics resist is aliquid chemical at aconstant temperature. If the spin speed is reduced to rpm, the topology of the roic will be smoothed to less than a. In this research, solutions of polystyrene in toluene are spin. Characteristics of diamond turned nip smoothed with ion.
After the spin coating and the partial cure, the stepheight in the patterned substrate is reduced from 400 nm to 40 nm clearly showing the planarization property of bcb. Although spin coating is an established technique for resist deposition, it is often not suitable for applications with high topography on silicon or glass fig. Characteristics of diamond turned nip smoothed with ion beam. Solvent concentration measurement for spin coating wiley online. Coating this figure shows an array of trenches, that were dynamic surface tension process created in silicon by using deep reactive ion etching drie process, and were further coated with consider a solution here polymer poured on the commercial photoresist shipley spr 2203. The planarizing properties of the spin coating process can be better understood by treating the resulting topography after spin coating as the output of a low pass.
The coat bowl, spin chuck, and the coat bowl lid all spin in synchronization. These films may be used for planarization and photolithography sacrificial layers, or as interlayer di electric insulators permanent layers. Spin coating of resist and polyimide films onto silicon wafers is an important step in the fabrication of integrated circuits. Three different deposition processes are considered. Using fill patterns for advanced packaging technologies by. Emsile, bonner and peck16 analyzed the spin coating process and. Lpcvd ge, pecvd ge, si3n4, sio2 and spin coating bcb, resist, polyimide.
During photolithography, it was evenly spread over the surface of the water by spin coating, and it was used as a medium for changing the reticle pattern. The combination of spin speed and time selected for this stage will generally define the final film thickness meyerhofer 1978, miitzi et al. Leveling of thin films over uneven substrates during spin coating. Aug 24, 2009 the results of a study of topographic substrate planarization with films applied by a spincoating process are reported. Polymer properties, such as molecular weight, have significant effects on the conformality of the coating film on vertical and sloping step topography.
Spin coating and planarization, proceedings of spie 10. A model for predicting film thickness profiles around topographical features during spin coating is presented. Pdf planarization of patterned recording media mojtaba. A parametric study of spin coating over topography. Effective utilization of honeywell spin on glass materials for the planarization of integrated circuits requires that the proper spin bakecure procedures be applied in order to achieve a high. These materials have good thermal stability, high transparency, and excellent planarization properties. A new method to characterize conformality of barc coatings. Pdf there are four parameters concerning the spin coating of a positive photoresist film. Study of flowability effect on selfplanarization performance. Soc with different concepts for improved planarization and the influence of thermal flow temperature, crosslink, film shrinkage, baking conditions on planarization and filling performance are described in this paper. Spin coating and planarization stillwagon, larry e larson, ronald g taylor, gary n. Reversal imprinting by transferring polymer from mold to. The substrate is then rotated at speed up to 10,000 rpm to spread the coating material by centrifugal force. Pin coating is used in microfabrication to deposit.
Planarization of topography with spinon carbon hard mask. S photoresist films for microlithography 11 and spinon glass for interlevel dielectric planarization 2. We provide an optimized technical solution for the planarization and associated edge bead removalalong with useful spin speed versus thickness data of pdms films. However, the spin coating of pdms films in the 100 m. This model is applicable to features of arbitrary geometry in the two lateral dimensions. Analytical solutions of film planarization during spin coating to cite this article. Dielectric spin coating characterization, modeling. Several efforts to obtain a conformal coating layer by using spin coating have been reported 1, 2. In comparison to cvd process for acl, carbonbased spin on hardmask material can offer several benefits. These results are quite reproducible and clearly demonstrate that the air shear force driven by the spinning process significantly enhances the surface planarization of the multilayer films. Pdf study of optimization condition for spin coating of the.
Spin coating due to the high potential homogeneity and throughput, spin coating is by far the most common method for coating substrates with photoresists. Current arc technology rarely uses unmodified materials, although they retain important roles in electrical component coatings such as resistors and molding compounds as well as spin on dielectrics sod in microelectronic interlayer dielectric and planarization applications. Finally, the findings suggest that if a planarized pdms film having a thickness of m is required, a single very low spin speed coating followed by an enhanced reflow planarization is preferable to multiple higher spin speed coatings and planarization steps. After spin coating, the step height of the coated mold depends both on the. Here, we study the reflow planarization and edge bead reduction of spin coated pdms films obtained in the spin speed range 250500 rpm. Planarization of high topography surfaces with deep holes and. The coating concentration during spinning is measured online using a. The profiles are quantitatively described by a simple lubrication theory that takes advantage of the thinness of. An accuflo layer with a better fluidity than the spin onglass material is formed on the spin onglass layer. We show that spin coating produces conformal film profiles over gaps on the substrate with widths greater than about 50 pm and that filling of these gaps can only occur after spinning has ceased provided the film is able to flow over large distances. Solvent retention is an important factor for determining the coating profile during spinning. A recently proposed twostage flowshrinkage model of leveling or planarization of uneven substrate topography during spin coating stillwagon and larson. Techniques and application areas principle of spin coating. Planarization of substrate topography by spin coating iopscience.
Pdf ultraviolet crosslink process using spincoating. Test structures that represent a wide range of underlying feature widths, spacings, and heights are designed and fabricated. The ultraviolet crosslink process and spin coating material have been optimized and studied for excellent global planarization property. A typical spincoating system for microelectronic wafers is shown in fig.
Novel planarization and passivation in the integration of iii. The resist was a mixture of three components, resin, sensitizer and solvent. Filling and planarizing deep trenches with polymeric material. A single coating of bcb with spin speed at 5000 rpm can reduce the 2. In general, higher spin speeds and longer spin times create thinner films. To gain more understanding of the planarization process in. Dielectric spin coating characterization, modeling, and. It is shown that spin coating produces conformal film profiles over topographic gaps on the substrate that are wider than about 50 um and that leveling of these gaps can only occur after spinning ceases if the film is able to. Spin coating is a procedure used to deposit uniform thin films onto flat substrates. Table 2 shows the planarization results of bcb at different spin speed. Pdf new photoresist coating method for high topography. Dielectric spin coating characterization, modeling, and planarization using fill patterns for advanced packaging technologies by christopher ilic lang s. At high rotation speeds, around to 10 000 rpm, such devices spin lowviscosity liquids to thicknesses from a few microns down to a few nanometers. Plasma treatment was used to mechanically strengthen the hsq resist, and etch back was used to remove excess material.
1682 164 319 426 1224 44 1451 1819 1818 1675 1842 1426 894 103 25 1102 455 1332 493 92 1134 1324 539 1592 431 143 625 1647 1779 651 1038 1194